hothree HTGP300 ( Thermal silicone pad )is a soft and compliant gap filling material.

The material offers exceptional thermal performance at low pressures.

hothree HTGP300 (Thermal Conductivity Silicone Gasket)maintains a conformable nature that allows 

for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness and/or topography.

hothree HTGP300 is offered with natural inherent tack on both sides of the material.

hothree HTGP 300 (Thermal Conductive Silicone Pad) can be die-cut into various shapes,easy to operate. 

The thermal conductivity can reach 3.0w/m-k and the standard hardness is 40 shore00.

Thickness is 0.3~6mm and the standard specification is W200mm*L400mm/sheet.

Produced by our own formula, we can customize the color, hardness and thickness according to the requirements.

hothree HTGP 300 (Thermal interface material )  Applications

• Telecommunications

• Consumer electronics

• Thermal modules

hothree HTGP 300 (Thermal silicone pad) can replace BERGQUIST GPHC3.0,BERGQUIST GAP PAD HC3.0,BERGQUIST GAP PAD TGP HC3000,

BERGQUIST GP3000S30,BERGQUIST GAP PAD 3000S30,BERGQUIST GAP PAD TGP 3000

LAIRD TFLEX HD300,LAIRD TFLEX300,LAIRD TFLEX HD9000

FUJIPOLY SARCON PG80B,SARCON PG80A,FUJIPOLY GR-HM