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BERGQUIST BOND-PLY TBP 400Preturn


    Features and Benefits

    • Thermal impedance:

    0.87°C-in. 2 /W (at 50 psi)

    • Highly puncture-resistant polyimide

    reinforcement carrier

    • Double-sided pressure sensitive

    adhesive tape

    • Provides a mechanical bond,

    eliminating the need for mechanical

    fasteners or screws


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BERGQUIST BOND-PLY TBP 400P Formerly known as BOND-PLY 660P


Thermally Conductive, Film Reinforced, Pressure Sensitive Adhesive Tape


BERGQUIST BOND-PLY TBP 400P is a thermally conductive, electrically insulating, double-sided pressure

sensitive adhesive tape. The tape consists of a high performance, thermally conductive acrylic adhesive coated

on both sides of a polyimide film. Use BERGQUIST BOND-PLY TBP 400P in applications to replace mechanical

fasteners or screws.


BERGQUIST BOND-PLY 660P Typical Applications Include:

• Heat sink onto BGA graphic processor

• Heat sink onto drive processor

• Heat spreader onto power

converter PCB

• Heat spreader onto motor control PCB


BERGQUIST BP660P Configurations Available:

• Roll form and die-cut parts

The material as delivered will

include a continuous base liner with

differential release properties to allow

for simplicity in roll packaging and

application assembly.



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