Features and Benefits
• Thermal conductivity: 2.0W/m-K
• Electrical insulation
• Silicone-free composition
hothree HTGP 200SF(Non-Silicone Thermal Pad) is a silicone-free thermally conductive gasket made from a non-silicone resin base
filled with a variety of high performance ceramic powders. It is cost effective, well insulated and flame retardant.
hothree HTGP 200SF (Silicone-Free Gap Filling Material) can be die-cut into various shapes,easy to operate.
The thermal conductivity can reach 2.0w/m-k and the standard hardness is 45 shore00.
Thickness is 1.0~8mm and the standard specification is W200mm*L400mm/sheet.
Produced by our own formula, we can customize the color, hardness and thickness according to the requirements.
hothree HTGP 200SF (Silicone-free thermal pad) Applications
• Optical components
• Storage devices
• Silicon sensitive applications
hothree HTGP 200SF (Non-silicone thermally conductive gaskets) can replace BERGQUIST GP2500S40,GAP PAD 2000S40