硬度Hardness (shore 00)
Thermal Conductivity (W/m.k)
操作温度 Continuous Use Temp (℃)
电性能 Electrical performance
击穿电压 Dielectric Breakdown Voltage (v/mm)
体积电阻率 Volume Resistivity (Ohm-cm)
介电常数 Dielectric Constant @1MHz
常规性能 Conventional performance
保质期（月） Validity period (Months)
Thermal Conductive Silicone Gasket HSR-TGP1200 has a very high thermal conductivity of 12 W/mK and remains very flexible.
It can be used to cover uneven or irregular device surfaces and to fully fill the gap between the heat generating period and the heat sink or metal housing.
This allows heat to be transferred more efficiently to the heat sink, thus providing the device with operational efficiency and longevity.
Thermally Conductive Pad are self-adhesive and require no adhesive backing. For some special applications, they can also be coated on one
or both sides to make a single-sided non-stick or double-sided non-stick product for easy handling.
HSR-TGP1200 Thermal Silicone Pad