BERGQUIST Hi-Flow 625 is a film-reinforced phase change material.

The product consists of a thermally conductive 65°C phase change compound coated on PEN film. 

BERGQUIST HF625 is designed to be used as a thermal interface material between electronic power devices that require electrical isolation and a heat sink.

The reinforcement makes Hi-Flow 625 easy to handle, and the 65°C phase change temperature of the coating material eliminates shipping and handling problems.

The PEN film has a continuous use temperature of 150°C.HI FLOW THF 500 is tack-free and scratch-resistant at production temperature and 

does not require a protective liner in most shipping situations. The material has the thermal performance of 2-3 mil mica and grease assemblies.

BERGQUIST HF625 Typical Applications Include: 

1.Spring / clip mounted 

2. Power semiconductors 

3.Power modules 

HI FLOW THF 500 Configurations Available: 

1.Sheet form, die-cut parts and roll form 

2. With or without pressure sensitive adhesive