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BERGQUIST GAP PAD TGP A2600return


    Features and Benefits

    1.Thermal conductivity: 2.6 W/m-K 

    2.Fiberglass-reinforced for puncture,  shear and tear resistance 

    3. Reduced tack on one side to aid in  application assembly 

    4. Electrically isolating


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BERGQUIST GAP PAD TGP A2600 is  a thermally conductive, filled-polymer  laminate, supplied on a reinforcing  

mesh for added electrical isolation,  easy material handling and enhanced  puncture, shear and tear resistance.  

BERGQUIST GAP PAD A3000 has a  reinforcement layer on the dark gold side  of the material that assists 

in burn-in and  rework processes while the light gold  and soft side of the material allows for  added compliance.


BERGQUIST GAP PAD A3000 Typical Applications Include: 

1. Computers and peripherals 

2. Heat pipe assemblies 

3.CD-ROM and DVD cooling 

4. Areas where heat needs to be  transferred to a frame, chassis or other  type of heat spreader 

5.Telecommunications • Memory modules 

6. Between CPU and heat spreader 


BERGQUIST GAP PAD TGP A2600 Configurations Available: 

1.Sheet form, die-cut parts and roll form (converted or unconverted)



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