BERGQUIST GAP PAD TGP 3500ULM (ultra-low modulus) is an extremely soft gap filling material with a thermal conductivity of 3.5 W/m-K. 

The material offers exceptional thermal performance at low pressures due to a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. 

The enhanced material is well suited for high performance applications requiring extremely low assembly stress. 

BERGQUIST GAP PAD 3500ULM maintains a conformable nature that allows for excellent interfacing and wet-out characteristics, 

even to surfaces with high roughness and/or topography. BERGQUIST GAP PAD TGP 3500ULM is offered with and without fiberglass 

and has higher natural inherent tack on one side of the material, eliminating the need for thermallyimpeding adhesive layers. 

The top side has minimal tack for ease of handling. BERGQUIST GAP PAD 3500ULM is supplied with protective liners on both sides.

TYPICAL APPLICATIONS ● Consumer electronics ● ASICs and DSPs ● Telecommunications ● PC applications

TYPICAL PROPERTIES OF CURED MATERIAL Young's modulus is calculated using 0.01in/min, 

step rate of strain with a sample size 0.79 in², after 5 minutes of compression at 10% strain on a 1mm thickness material.

Physical Properties Hardness, Shore 000 , 30 seconds delay value @ 125 mil 70 Heat Capacity, ASTM E1269, J/g-K 1.0 

Density, Bulk rubber, ASTM D792, g/cc 3.1 Flammability, UL 94 V-0 Young's Modulus kPa 27.5 (psi) (4)

Electrical Properties Dielectric Breakdown Voltage , ASTM D149, VAC >5,000 Dielectric Constant, ASTM D150, 

1,000Hz 6.0 Minimum value at 20 mil. Volume Resistivity, ASTM D257, ohm-meter 1×1010