BERGQUIST SIL PAD TSP 1700L material is designed for

applications where low mounting pressure is used and low

thermal resistance is required. BERGQUIST SIL-PAD 1000L

achieves this with the combination of a smooth surface

design and high thermal conductivity (dielectric) silicone rubber

.

Applications requiring low component clamping forces include

discrete semiconductors (TO-220, TO-247 and TO-218)

mounted with spring clips. Spring clips provide quick assembly

but apply a limited amount of pressure to the semiconductor.

The smooth surface texture of BERGQUIST SP1000L

minimizes interfacial thermal resistance and maximizes

thermal performance.